Intel BXM80530B106GC

表面安装

NO

终端数量

478

Manufacturer Part Number

BXM80530B106GC

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Package Description

SPGA, PGA478,26X26,50

Risk Rank

5.92

Package Body Material

CERAMIC

Package Code

SPGA

Package Equivalence Code

PGA478,26X26,50

Package Shape

SQUARE

Package Style

GRID ARRAY, SHRINK PITCH

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

PERPENDICULAR

终端形式

PIN/PEG

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

S-XPGA-P478

资历状况

不合格

电源

1.25,1.45 V

速度

1060 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

电源电流-最大值

18600 mA

位元大小

32