Intel C8751H

表面安装

NO

终端数量

40

Package Description

DIP,

Package Style

IN-LINE

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Manufacturer Part Number

C8751H

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Risk Rank

5.59

HTS代码

8542.31.00.01

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-CDIP-T40

uPs/uCs/外围ICs类型

MICROCONTROLLER

座位高度-最大

5.51 mm

宽度

15.24 mm

长度

50.8 mm