Intel CS82TPCF

表面安装

YES

终端数量

376

Package Description

BGA,

Package Style

网格排列

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1.2 V

Supply Voltage-Min

1.14 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

CS82TPCF

Clock Frequency-Max

100 MHz

Package Code

BGA

Package Shape

SQUARE

Manufacturer

Intel Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Supply Voltage-Max

1.26 V

Risk Rank

5.61

Part Package Code

BGA

ECCN 代码

3A001.A.3

HTS代码

8542.31.00.01

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

compliant

引脚数量

376

JESD-30代码

S-PBGA-B376

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

BUS CONTROLLER, PCI

座位高度-最大

2.34 mm

总线兼容性

I2C

最大数据传输率

12 MBps

驱动接口标准

IEEE 802.3; IEEE 1588

宽度

23 mm

长度

23 mm