Intel D8251

表面安装

NO

终端数量

28

Package Description

DIP,

Package Style

IN-LINE

Package Body Material

CERAMIC, GLASS-SEALED

Supply Voltage-Nom

5 V

Supply Voltage-Min

4.75 V

Operating Temperature-Max

70 °C

Manufacturer Part Number

D8251

Clock Frequency-Max

2.38 MHz

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Supply Voltage-Max

5.25 V

Risk Rank

5.71

HTS代码

8542.31.00.01

技术

MOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-GDIP-T28

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

座位高度-最大

5.715 mm

边界扫描

NO

低功率模式

NO

外部数据总线宽度

8

串行I/O数

1

总线兼容性

8080A

通信协议

ASYNC, BIT; SYNC, BYTE; BISYNC; EXT SYNC

数据编码/解码方式

NRZ

宽度

15.24 mm

长度

37.1475 mm