Intel D82530

表面安装

NO

终端数量

40

RoHS

Non-Compliant

Package Description

DIP,

Package Style

IN-LINE

Package Body Material

CERAMIC, GLASS-SEALED

Supply Voltage-Nom

5 V

Manufacturer Part Number

D82530

Clock Frequency-Max

4 MHz

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Risk Rank

5.73

技术

NMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-GDIP-T40

uPs/uCs/外围ICs类型

SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL

座位高度-最大

5.72 mm

边界扫描

NO

低功率模式

NO

外部数据总线宽度

8

串行I/O数

2

总线兼容性

MCS 51; MCS 96; IAPX 86; IAPX 88; IAPX 186; IAPX 188

最大数据传输率

0.125 MBps

通信协议

ASYNC, BIT; SYNC, BYTE; SYNC, SDLC; X.25; BISYNC; EXT SYNC

数据编码/解码方式

NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)

宽度

15.24 mm

长度

52.325 mm