Intel EPM1270T100C5N

表面安装

YES

终端数量

100

Manufacturer Part Number

EPM1270T100C5N

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

INTEL CORP

Package Description

QFP,

Risk Rank

5.36

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Package Code

QFP

Package Shape

SQUARE

Package Style

FLATPACK

Supply Voltage-Max

2.625 V

Supply Voltage-Min

2.375 V

Supply Voltage-Nom

2.5 V

Reflow Temperature-Max (s)

40

JESD-609代码

e3

端子表面处理

MATTE TIN (472) OVER COPPER

附加功能

IT CAN ALSO OPERATE AT 3.3V

HTS代码

8542.39.00.01

端子位置

QUAD

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

Reach合规守则

compliant

JESD-30代码

S-PQFP-G100

资历状况

不合格

组织结构

0 DEDICATED INPUTS, 0 I/O

可编程逻辑类型

闪存 PLD

输出功能

MACROCELL