Intel GDPXA250B2C400

表面安装

YES

终端数量

256

Manufacturer Part Number

GDPXA250B2C400

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Package Description

BGA, BGA256,16X16,40

Risk Rank

8.82

Number of I/O Lines

81

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA256,16X16,40

Supply Voltage-Nom

3.3 V

Supply Voltage-Min

3 V

Supply Voltage-Max

3.6 V

Package Style

网格排列

Package Shape

SQUARE

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B256

温度等级

INDUSTRIAL

座位高度-最大

2 mm

地址总线宽度

26

边界扫描

YES

外部数据总线宽度

32

总线兼容性

I2C; I2S; IRDA; UART; USB

长度

17 mm

宽度

17 mm