Intel GW80314GN

表面安装

YES

终端数量

1025

Package Description

BGA, BGA1025,39X39,40

Package Style

网格排列

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA1025,39X39,40

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

GW80314GN

Package Code

BGA

Package Shape

SQUARE

Manufacturer

Intel Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Risk Rank

5.88

子类别

Other uPs/uCs/Peripheral ICs

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B1025

资历状况

不合格

电源

1.2,2.5,3.3 V

温度等级

COMMERCIAL