Intel HE8066201930521 SR2EN

包装/外壳

FCBGA-1515

表面安装

YES

终端数量

1515

TDP - Max

4.5 W

Moisture Sensitive

有

Maximum Clock Frequency

2.2 GHz

Processor Series

M3-6Y30

PCIe Revision

Revision 3.0

CPU Configuration - Max

1 Configuration

Maximum Operating Temperature

+ 100 C

Cache Memory

4 MB

Factory Pack QuantityFactory Pack Quantity

1

Mounting Styles

SMD/SMT

Number of Memory Channels

2 Channel

Code Name

Skylake

Part # Aliases

944326

Manufacturer

Intel

Brand

Intel

PCIe Configurations

1x4, 2x2, 1x2 + 2x1, 4x1

Number of Displays Supported

3 Display

Embedded Options

Non-Embedded

RoHS

Details

Memory Types

DDR3L-1600, LPDDR3-1866

Package Description

BGA,

Package Style

网格排列

Package Body Material

PLASTIC/EPOXY

Manufacturer Part Number

HE8066201930521SR2EN

Package Code

BGA

Package Shape

RECTANGULAR

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Risk Rank

5.82

包装

Tray

子类别

Embedded Processors & Controllers

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

Reach合规守则

compliant

JESD-30代码

R-PBGA-B1515

内存大小

16 GB

速度

2200 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR

家人

Intel Core M

数据总线宽度

64 bit

产品类别

CPU - Central Processing Units

边界扫描

NO

低功率模式

NO

格式

固定点

集成缓存

YES

核数量

2 Core

产品

Mobile Processors

产品类别

CPU - Central Processing Units