Intel HL82576EB/SLJBC

表面安装

YES

终端数量

576

Manufacturer Part Number

HL82576EB/SLJBC

Part Life Cycle Code

活跃

Ihs Manufacturer

INTEL CORP

Package Description

25 X 25 MM, 1 MM PITCH, FCBGA-576

Risk Rank

5.77

Clock Frequency-Max

25 MHz

Operating Temperature-Max

55 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Shape

SQUARE

Package Style

网格排列

Supply Voltage-Max

1.89 V

Supply Voltage-Min

1.71 V

Supply Voltage-Nom

1.8 V

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B576

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

SERIAL IO/COMMUNICATION CONTROLLER, LAN

边界扫描

YES

低功率模式

YES

串行I/O数

2

总线兼容性

PCI

最大数据传输率

128 MBps

通信协议

ASYNC, BIT; I2C

数据编码/解码方式

BIPH-LEVEL(MANCHESTER)

长度

25 mm

宽度

25 mm