Intel JL82599EBSLGWG

表面安装

YES

终端数量

576

Manufacturer Part Number

JL82599EBSLGWG

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Package Description

BGA, BGA576,24X24,40

Risk Rank

5.74

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA576,24X24,40

Package Shape

SQUARE

Package Style

网格排列

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B576

资历状况

不合格

电源

1.2,3.3 V

uPs/uCs/外围ICs类型

SERIAL IO/COMMUNICATION CONTROLLER, LAN