Intel KU82360SLB1

表面安装

YES

终端数量

196

RoHS

Non-Compliant

Package Description

BQFP, SPQFP196,1.5SQ

Package Style

FLATPACK

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

SPQFP196,1.5SQ

Supply Voltage-Nom

5 V

Operating Temperature-Max

90 °C

Rohs Code

无

Manufacturer Part Number

KU82360SLB1

Package Code

BQFP

Package Shape

SQUARE

Manufacturer

Intel Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Risk Rank

5.85

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Other uPs/uCs/Peripheral ICs

技术

CMOS

端子位置

QUAD

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

compliant

JESD-30代码

S-PQFP-G196

资历状况

不合格

电源

5 V

温度等级

OTHER

电源电流-最大值

100 mA