Intel MD27C256-25/B

表面安装

YES

终端数量

32

Package Style

CHIP CARRIER

Number of Words Code

32000

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Operating Temperature-Min

-55 °C

Access Time-Max

250 ns

Operating Temperature-Max

125 °C

Manufacturer Part Number

MD27C256-25/B

Number of Words

32768 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

QCCJ

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Package Description

CERAMIC, JLCC-32

Risk Rank

2.14

技术

CMOS

端子位置

QUAD

终端形式

J BEND

功能数量

1

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

R-CQCC-J32

电源电压-最大值(Vsup)

5.5 V

温度等级

MILITARY

电源电压-最小值(Vsup)

4.5 V

操作模式

ASYNCHRONOUS

组织结构

32KX8

座位高度-最大

4.2418 mm

内存宽度

8

记忆密度

262144 bit

并行/串行

PARALLEL

内存IC类型

UVPROM

宽度

11.557 mm

长度

15.04 mm