Intel MD82C55A/B

表面安装

NO

终端数量

40

Ihs Manufacturer

RENESAS ELECTRONICS CORP

Manufacturer

Renesas Electronics Corporation

Manufacturer Package Code

F40.640

Manufacturer Part Number

MD82C55A/B

Number of I/O Lines

24

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC, GLASS-SEALED

Package Code

DIP

Package Description

DIP,

Package Shape

RECTANGULAR

Package Style

IN-LINE

Part Life Cycle Code

活跃

Part Package Code

CERDIP

Reflow Temperature-Max (s)

NOT APPLICABLE

Risk Rank

5.19

Samacsys Description

Interface - I/O Expanders

Supply Voltage-Max

5.5 V

Supply Voltage-Min

4.5 V

Supply Voltage-Nom

5 V

JESD-609代码

e0

ECCN 代码

EAR99

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.39.00.01

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

峰值回流焊温度（摄氏度）

NOT APPLICABLE

端子间距

2.54 mm

Reach合规守则

unknown

引脚数量

40

JESD-30代码

R-GDIP-T40

资历状况

不合格

Brand Name

Renesas

温度等级

MILITARY

端口的数量

3

uPs/uCs/外围ICs类型

PARALLEL IO PORT, GENERAL PURPOSE

座位高度-最大

5.72 mm

宽度

15.24 mm