Intel NH82801IBSLA9M

包装/外壳

mBGA-676

表面安装

YES

终端数量

676

TDP - Max

4.3 W

Moisture Sensitive

有

Maximum Operating Temperature

+ 96 C

Supply Voltage-Max

1.5 V, 2.5 V, 3.3 V, 5 V

Factory Pack QuantityFactory Pack Quantity

360

Supply Voltage-Min

1.5 V, 2.5 V, 3.3 V, 5 V

Mounting Styles

SMD/SMT

Code Name

ICH9

Part # Aliases

890310

Manufacturer

Intel

Brand

Intel

RoHS

Details

Package Description

BGA, BGA676,30X30,40

Package Style

网格排列

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA676,30X30,40

Rohs Code

有

Manufacturer Part Number

NH82801IB/SLA9M

Package Code

BGA

Package Shape

SQUARE

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Risk Rank

5.84

包装

MouseReel

类型

ICH, I/O Controller Hub

子类别

接口集成电路

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B676

资历状况

不合格

工作电源电压

1.5 V, 2.5 V, 3.3 V, 5 V

电源

1.05,1.5,3.3,5 V

电源电流-最大值

308 mA

产品类别

I/O Controller Interface IC

产品

移动芯片组

产品类别

I/O Controller Interface IC

宽度

31 mm

长度

31 mm