Intel Corporation EP4CE75F23

表面安装

YES

Contact plating

gold-plated

Number of pins

36

终端数量

484

Part Life Cycle Code

活跃

Ihs Manufacturer

INTEL CORP

Package Description

FBGA-484

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Shape

SQUARE

Package Style

网格排列

Supply Voltage-Max

1.24 V

Supply Voltage-Min

1.16 V

Supply Voltage-Nom

1.2 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

SMT

Connector pinout layout

2x18

Row pitch

2.54mm

Gross weight

1.74 g

Operating temperature

-40...163°C

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

compliant

Current rating

3A

JESD-30代码

S-PBGA-B484

组织结构

47 CLBS

座位高度-最大

2.4 mm

可编程逻辑类型

现场可编程门阵列

逻辑块数量

47

Rated voltage

150V

个人资料

beryllium copper

长度

23 mm

宽度

23 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0