Intersil CD74AC257SM

表面安装

YES

终端数量

16

RoHS

Non-Compliant

Package Description

SSOP, SSOP16,.3

Package Style

SMALL OUTLINE, SHRINK PITCH

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

SSOP16,.3

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

CD74AC257SM

Package Code

SSOP

Package Shape

RECTANGULAR

Manufacturer

Harris Semiconductor

Part Life Cycle Code

Obsolete

Ihs Manufacturer

HARRIS SEMICONDUCTOR

Risk Rank

5.66

Prop.

13 ns

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Multiplexer/Demultiplexers

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

功能数量

4

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G16

资历状况

不合格

电源

3.3/5 V

温度等级

MILITARY

输入数量

2

输出特性

3-STATE

逻辑IC类型

MULTIPLEXER

最大 I(ol)

0.012 A