Intersil CDP68HC68S1M

表面安装

YES

终端数量

20

Package Description

SOP, SOP20,.4

Package Style

小概要

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

SOP20,.4

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

5 V

Supply Voltage-Min

4 V

Operating Temperature-Max

105 °C

Rohs Code

无

Manufacturer Part Number

CDP68HC68S1M

Package Code

SOP

Package Shape

RECTANGULAR

Manufacturer

Harris Semiconductor

Part Life Cycle Code

Transferred

Ihs Manufacturer

HARRIS SEMICONDUCTOR

Supply Voltage-Max

7 V

Risk Rank

5.71

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.31.00.01

子类别

系统接口逻辑

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G20

资历状况

不合格

电源

5 V

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

微处理器电路