Intersil (Renesas Electronics America) HFA1145MJ/883
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HFA1145MJ/883
1244-HFA1145MJ/883
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HFA1145MJ/883 datasheet pdf and Integrated Circuits (ICs) product details from Intersil (Renesas Electronics America) stock available at utmel
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HFA1145MJ/883详情
Intersil (Renesas Electronics America) HFA1145MJ/883重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
表面安装
NO
终端数量
8
Manufacturer Part Number
HFA1145MJ/883
Rohs Code
无
Part Life Cycle Code
Transferred
Ihs Manufacturer
HARRIS SEMICONDUCTOR
Package Description
,
Risk Rank
5.82
Package Body Material
CERAMIC, GLASS-SEALED
Package Shape
RECTANGULAR
Package Style
IN-LINE
JESD-609代码
e0
ECCN 代码
EAR99
端子表面处理
Tin/Lead (Sn/Pb)
HTS代码
8542.33.00.01
端子位置
DUAL
终端形式
THROUGH-HOLE
功能数量
1
Reach合规守则
unknown
JESD-30代码
R-GDIP-T8
资历状况
不合格
温度等级
MILITARY
放大器类型
OPERATIONAL AMPLIFIER
HFA1145MJ/883拓展信息
Intersil (Renesas Electronics America)
Intersil (Renesas Electronics America)
Intersil (Renesas Electronics America)
Intersil (Renesas Electronics America)
Intersil (Renesas Electronics America)
Intersil (Renesas Electronics America)
Intersil (Renesas Electronics America)
Intersil (Renesas Electronics America)
Intersil (Renesas Electronics America)
Intersil (Renesas Electronics America)







哦! 它是空的。