Intersil (Renesas Electronics America) HM1-7685-8

表面安装

NO

终端数量

18

Manufacturer Part Number

HM1-7685-8

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTERSIL CORP

Risk Rank

5.92

Access Time-Max

90 ns

Number of Words

2048 words

Number of Words Code

2000

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP18,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

not_compliant

JESD-30代码

R-XDIP-T18

资历状况

不合格

温度等级

MILITARY

电源电流-最大值

0.17 mA

组织结构

2KX4

内存宽度

4

记忆密度

8192 bit

筛选水平

MIL-STD-883 Class B (Modified)

内存IC类型

OTP ROM