Intersil (Renesas Electronics America) HS9-303RH/SAMPLE
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HS9-303RH/SAMPLE
1244-HS9-303RH/SAMPLE
集成电路(IC)
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DFP,
1最小包装量--
HS9-303RH/SAMPLE详情
Intersil (Renesas Electronics America) HS9-303RH/SAMPLE重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
表面安装
YES
终端数量
14
Manufacturer Part Number
HS9-303RH/SAMPLE
Part Life Cycle Code
Obsolete
Ihs Manufacturer
INTERSIL CORP
Part Package Code
DFP
Package Description
DFP,
Risk Rank
5.82
On-state Resistance-Max (Ron)
50 Ω
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
DFP
Package Shape
RECTANGULAR
Package Style
FLATPACK
Supply Voltage-Nom (Vsup)
15 V
HTS代码
8542.39.00.01
端子位置
DUAL
终端形式
FLAT
功能数量
2
端子间距
2.54 mm
Reach合规守则
unknown
引脚数量
14
JESD-30代码
R-CDFP-F14
资历状况
不合格
通道数量
1
模拟 IC - 其他类型
单刀双掷
座位高度-最大
5.08 mm
负电源电压(Vsup)
-15 V
开启时间-最大值
300 ns
关机时间-最大值
250 ns
长度
9.525 mm
宽度
7.62 mm
HS9-303RH/SAMPLE拓展信息
Intersil (Renesas Electronics America)
Intersil (Renesas Electronics America)
Intersil (Renesas Electronics America)
Intersil (Renesas Electronics America)
Intersil (Renesas Electronics America)
Intersil (Renesas Electronics America)
Intersil (Renesas Electronics America)
Intersil (Renesas Electronics America)
Intersil (Renesas Electronics America)
Intersil (Renesas Electronics America)







哦! 它是空的。