Intersil (Renesas Electronics America) IM5605CJG

表面安装

NO

终端数量

24

Manufacturer Part Number

IM5605CJG

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

GENERAL ELECTRIC SOLID STATE

Package Description

DIP, DIP24,.6

Risk Rank

5.92

Access Time-Max

90 ns

Package Style

IN-LINE

Package Shape

RECTANGULAR

Package Equivalence Code

DIP24,.6

Package Code

DIP

Package Body Material

CERAMIC

Operating Temperature-Max

70 °C

Number of Words Code

512

Number of Words

512 words

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T24

资历状况

不合格

温度等级

COMMERCIAL

电源电流-最大值

0.185 mA

组织结构

512X8

内存宽度

8

记忆密度

4096 bit

内存IC类型

OTP ROM