Intersil (Renesas Electronics America) IM5624CDE

表面安装

NO

终端数量

16

Manufacturer Part Number

IM5624CDE

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

GENERAL ELECTRIC SOLID STATE

Package Description

DIP, DIP16,.3

Risk Rank

5.92

Access Time-Max

80 ns

Number of Words

512 words

Number of Words Code

512

Operating Temperature-Max

70 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom (Vsup)

5 V

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

资历状况

不合格

电源

5 V

温度等级

COMMERCIAL

组织结构

512X4

内存宽度

4

记忆密度

2048 bit

内存IC类型

OTP ROM