Intersil (Renesas Electronics America) IM6512CJN

表面安装

NO

终端数量

18

Package Style

IN-LINE

Package Shape

RECTANGULAR

Package Equivalence Code

DIP18,.3

Package Code

DIP

Package Body Material

CERAMIC

Operating Temperature-Max

70 °C

Number of Words Code

64

Number of Words

64 words

Access Time-Max

600 ns

Risk Rank

5.92

Package Description

DIP, DIP18,.3

Ihs Manufacturer

GENERAL ELECTRIC SOLID STATE

Part Life Cycle Code

Obsolete

Rohs Code

无

Manufacturer Part Number

IM6512CJN

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T18

资历状况

不合格

温度等级

COMMERCIAL

操作模式

ASYNCHRONOUS

组织结构

64X12

输出特性

3-STATE

内存宽度

12

并行/串行

PARALLEL

内存IC类型

标准SRAM