Intersil (Renesas Electronics America) M37271EFSP

表面安装

NO

终端数量

52

Manufacturer Part Number

M37271EFSP

Part Life Cycle Code

活跃

Ihs Manufacturer

RENESAS ELECTRONICS CORP

Part Package Code

DIP

Package Description

0.600 INCH, 1.78 MM PITCH, PLASTIC, SDIP-52

Risk Rank

5.58

Clock Frequency-Max

8.1 MHz

Number of I/O Lines

39

Operating Temperature-Max

70 °C

Operating Temperature-Min

-10 °C

Package Body Material

PLASTIC/EPOXY

Package Code

SDIP

Package Shape

RECTANGULAR

Package Style

IN-LINE, SHRINK PITCH

Supply Voltage-Max

5.5 V

Supply Voltage-Min

4.5 V

Supply Voltage-Nom

5 V

HTS代码

8542.31.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

1.778 mm

Reach合规守则

compliant

引脚数量

52

JESD-30代码

R-PDIP-T52

资历状况

不合格

温度等级

COMMERCIAL

速度

8.1 MHz

uPs/uCs/外围ICs类型

MICROCONTROLLER

位元大小

8

有ADC

YES

DMA 通道

NO

脉宽调制通道

YES

数模转换器通道

NO

座位高度-最大

5.5 mm

只读存储器可编程性

OTPROM

长度

45.85 mm

宽度

15.24 mm