Intersil (Renesas Electronics America) UPB2089D

表面安装

NO

终端数量

16

Manufacturer Part Number

UPB2089D

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

RENESAS ELECTRONICS CORP

Package Description

DIP, DIP16,.3

Risk Rank

5.92

Access Time-Max

60 ns

Number of Words

16 words

Number of Words Code

16

Operating Temperature-Max

70 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom (Vsup)

5 V

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

资历状况

不合格

电源

5 V

温度等级

COMMERCIAL

操作模式

ASYNCHRONOUS

组织结构

16X4

输出特性

OPEN-COLLECTOR

内存宽度

4

并行/串行

PARALLEL

内存IC类型

标准SRAM