ISC BUK444-500B

表面安装

NO

终端数量

3

晶体管元件材料

SILICON

Package Description

FLANGE MOUNT, R-PSFM-T3

Package Style

FLANGE MOUNT

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Max

150 °C

Manufacturer Part Number

BUK444-500B

Turn-on Time-Max (ton)

80 ns

Package Shape

RECTANGULAR

Manufacturer

恩智浦半导体

Number of Elements

1

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Turn-off Time-Max (toff)

105 ns

Risk Rank

5.84

Drain Current-Max (ID)

1.9 A

端子位置

SINGLE

终端形式

THROUGH-HOLE

Reach合规守则

unknown

JESD-30代码

R-PSFM-T3

资历状况

不合格

配置

SINGLE WITH BUILT-IN DIODE

操作模式

增强型MOSFET

箱体转运

ISOLATED

晶体管应用

SWITCHING

极性/通道类型

N-CHANNEL

漏极-源极导通最大电阻

2.8 Ω

脉冲漏极电流-最大值(IDM)

7.6 A

DS 击穿电压-最小值

500 V

场效应管技术

METAL-OXIDE SEMICONDUCTOR

反馈上限-最大值 (Crss)

55 pF

环境耗散-最大值

25 W