ISSI IS66WVC2M16ECLL-7008BLI

表面安装

YES

终端数量

54

Package

零售包装

厂商

Glenair

Product Status

活跃

Package Description

VFBGA,

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Number of Words Code

2000000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Access Time-Max

70 ns

Operating Temperature-Max

85 °C

Manufacturer Part Number

IS66WVC2M16ECLL-7008BLI

Number of Words

2097152 words

Package Code

VFBGA

Package Shape

RECTANGULAR

Manufacturer

Integrated Silicon Solution Inc

Part Life Cycle Code

活跃

Ihs Manufacturer

INTEGRATED SILICON SOLUTION INC

Risk Rank

5.77

系列

*

ECCN 代码

3A991.B.2.A

HTS代码

8542.32.00.41

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.75 mm

JESD-30代码

R-PBGA-B54

电源电压-最大值(Vsup)

1.95 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

1.7 V

操作模式

SYNCHRONOUS

组织结构

2MX16

座位高度-最大

1 mm

内存宽度

16

记忆密度

33554432 bit

并行/串行

PARALLEL

内存IC类型

PSEUDO STATIC RAM

宽度

6 mm

长度

8 mm

达到SVHC

unknown