Lattice Semiconductor IS2063GM

表面安装

YES

终端数量

68

Package Description

HLGA,

Package Style

GRID ARRAY, HEAT SINK/SLUG

Package Body Material

UNSPECIFIED

Operating Temperature-Min

-20 °C

Supply Voltage-Nom

1.2 V

Operating Temperature-Max

70 °C

Manufacturer Part Number

IS2063GM

Package Code

HLGA

Package Shape

SQUARE

Manufacturer

Microchip Technology Inc

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Risk Rank

5.65

Usage Level

Automotive grade

端子位置

BOTTOM

终端形式

BUTT

功能数量

1

端子间距

0.4 mm

Reach合规守则

compliant

JESD-30代码

S-XBGA-B68

温度等级

OTHER

座位高度-最大

0.9 mm

筛选水平

TS 16949

通信IC类型

电信电路

宽度

8 mm

长度

8 mm