Lattice Semiconductor ISPGDX160V5B272

表面安装

YES

终端数量

272

Package Description

BGA,

Package Style

网格排列

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Nom

3.3 V

Supply Voltage-Min

3 V

Operating Temperature-Max

70 °C

Manufacturer Part Number

ISPGDX160V-5B272

Clock Frequency-Max

111 MHz

Package Code

BGA

Package Shape

SQUARE

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Number of I/O Lines

160

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Supply Voltage-Max

3.6 V

Risk Rank

5.78

Part Package Code

BGA

附加功能

USE ISPGDX160VA FOR NEW DESIGNS

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

1.27 mm

引脚数量

272

JESD-30代码

S-PBGA-B272

资历状况

COMMERCIAL

温度等级

COMMERCIAL

传播延迟

5 ns

组织结构

160 I/O

座位高度-最大

2.8 mm

可编程逻辑类型

EE PLD

输出功能

MACROCELL

宽度

27 mm

长度

27 mm

达到SVHC

unknown