Macronix MX25L25633FZ2I-10G

表面安装

YES

终端数量

8

Package Description

HVSON,

Package Style

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Number of Words Code

32000000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Manufacturer Part Number

MX25L25633FZ2I-10G

Clock Frequency-Max (fCLK)

104 MHz

Number of Words

33554432 words

Supply Voltage-Nom (Vsup)

3 V

Package Code

HVSON

Package Shape

RECTANGULAR

Manufacturer

Macronix International Co Ltd

Part Life Cycle Code

不推荐

Ihs Manufacturer

MACRONIX INTERNATIONAL CO LTD

Risk Rank

5.79

附加功能

IT CAN ALSO CONFIGURED AS 128M X 2 AND 256M X 1

技术

CMOS

端子位置

DUAL

终端形式

无铅

功能数量

1

端子间距

1.27 mm

JESD-30代码

R-PDSO-N8

电源电压-最大值(Vsup)

3.6 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2.7 V

操作模式

SYNCHRONOUS

组织结构

32MX8

座位高度-最大

0.8 mm

内存宽度

8

记忆密度

268435456 bit

并行/串行

SERIAL

内存IC类型

FLASH

编程电压

3 V

备用内存宽度

4

宽度

6 mm

长度

8 mm

达到SVHC

unknown