Macronix MX25R1035FZUIH1

表面安装

YES

终端数量

8

Package Description

HVBCC,

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Number of Words Code

256000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Manufacturer Part Number

MX25R1035FZUIH1

Clock Frequency-Max (fCLK)

108 MHz

Number of Words

262144 words

Supply Voltage-Nom (Vsup)

1.8 V

Package Code

HVBCC

Package Shape

RECTANGULAR

Manufacturer

Macronix International Co Ltd

Part Life Cycle Code

活跃

Ihs Manufacturer

MACRONIX INTERNATIONAL CO LTD

Risk Rank

5.78

附加功能

ALSO CONFIGURABLE AS 1MX1

技术

CMOS

端子位置

BOTTOM

终端形式

BUTT

功能数量

1

端子间距

0.5 mm

JESD-30代码

R-PBCC-B8

电源电压-最大值(Vsup)

3.6 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

1.65 V

操作模式

SYNCHRONOUS

组织结构

256KX4

座位高度-最大

0.6 mm

内存宽度

4

记忆密度

1048576 bit

并行/串行

SERIAL

内存IC类型

FLASH

编程电压

1.8 V

备用内存宽度

2

宽度

2 mm

长度

3 mm

达到SVHC

unknown