Macronix MX63U4GA2GHAXMI00

表面安装

YES

终端数量

162

Package Description

VFBGA, BGA162, 10X20,20

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Number of Words Code

512000000

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA162, 10X20,20

Operating Temperature-Min

-30 °C

Operating Temperature-Max

85 °C

Manufacturer Part Number

MX63U4GA2GHAXMI00

Number of Words

536870912 words

Supply Voltage-Nom (Vsup)

1.8 V

Package Code

VFBGA

Package Shape

RECTANGULAR

Manufacturer

Macronix International Co Ltd

Part Life Cycle Code

活跃

Ihs Manufacturer

MACRONIX INTERNATIONAL CO LTD

Risk Rank

5.62

附加功能

IT ALSO CONTAINS 2GBIT(64M X 32) DDR2 MEMORY OPERATES AT 1.8V AND 1.2V NOM SUPPLY

HTS代码

8542.32.00.71

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-B162

电源电压-最大值(Vsup)

1.95 V

温度等级

OTHER

电源电压-最小值(Vsup)

1.7 V

操作模式

SYNCHRONOUS

组织结构

512MX8

座位高度-最大

1 mm

内存宽度

8

记忆密度

4294967296 bit

内存IC类型

存储器电路

混合内存类型

FLASH+DDR2

宽度

8 mm

长度

10.5 mm