Maxim 73K324BL-IH/F

表面安装

YES

终端数量

32

Package Description

LEAD FREE, PLASTIC, LCC-32

Package Style

CHIP CARRIER

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

5 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

73K324BL-IH/F

Package Code

QCCJ

Package Shape

RECTANGULAR

Manufacturer

Teridian Semiconductor Corp

Part Life Cycle Code

Obsolete

Ihs Manufacturer

TERIDIAN SEMICONDUCTOR CORP

Risk Rank

5.58

技术

CMOS

端子位置

QUAD

终端形式

J BEND

功能数量

1

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

R-PQCC-J32

资历状况

不合格

温度等级

INDUSTRIAL

数据率

2.4 Mbps

座位高度-最大

3.56 mm

通信IC类型

MODEM

宽度

11.455 mm

长度

14 mm