Maxim Integrated 73M1922-IM/F

表面安装

YES

终端数量

32

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Package Shape

SQUARE

Package Code

HVQCCN

Package Body Material

UNSPECIFIED

Operating Temperature-Max

85 °C

Risk Rank

5.62

Package Description

5 X 5 MM, ROHS COMPLIANT, QFN-32

Ihs Manufacturer

TERIDIAN SEMICONDUCTOR CORP

Part Life Cycle Code

Transferred

Manufacturer Part Number

73M1922-IM/F

端子位置

QUAD

终端形式

无铅

功能数量

1

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

S-XQCC-N32

电源电压-最大值(Vsup)

3.6 V

温度等级

OTHER

电源电压-最小值(Vsup)

3 V

座位高度-最大

0.9 mm

消费者集成电路类型

消费电路

宽度

5 mm

长度

5 mm