Microchip 5962-9958602QXC

表面安装

YES

终端数量

256

Package Description

GQFF,

Package Style

FLATPACK, GUARD RING

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Operating Temperature-Min

-55 °C

Supply Voltage-Nom

3.3 V

Supply Voltage-Min

3 V

Operating Temperature-Max

125 °C

Manufacturer Part Number

5962-9958602QXC

Package Code

GQFF

Package Shape

SQUARE

Manufacturer

Microsemi Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICROSEMI CORP

Supply Voltage-Max

3.6 V

Risk Rank

5.23

Usage Level

Military grade

JESD-609代码

e4

ECCN 代码

3A001.A.2.C

端子表面处理

GOLD

附加功能

ALSO OPERATES AT 5V SUPPLY

HTS代码

8542.39.00.01

技术

CMOS

端子位置

QUAD

终端形式

FLAT

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

S-CQFP-F256

资历状况

Qualified

温度等级

MILITARY

组织结构

2880 CLBS, 32000 GATES

座位高度-最大

3.81 mm

可编程逻辑类型

现场可编程门阵列

筛选水平

MIL-PRF-38535 Class Q

CLB-Max的组合延时

0.9 ns

逻辑块数量

2880

等效门数

32000

宽度

36 mm

长度

36 mm