Microchip A14100A-2PG257C

表面安装

NO

终端数量

257

Package Description

HPGA,

Package Style

GRID ARRAY, HEAT SINK/SLUG

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Supply Voltage-Nom

5 V

Supply Voltage-Min

4.75 V

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

A14100A-2PG257C

Clock Frequency-Max

150 MHz

Package Code

HPGA

Package Shape

SQUARE

Manufacturer

Microsemi Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICROSEMI CORP

Supply Voltage-Max

5.25 V

Risk Rank

5.88

HTS代码

8542.39.00.01

技术

CMOS

端子位置

PERPENDICULAR

终端形式

PIN/PEG

端子间距

2.54 mm

Reach合规守则

compliant

JESD-30代码

S-CPGA-P257

温度等级

COMMERCIAL

组织结构

1377 CLBS, 10000 GATES

座位高度-最大

6.7818 mm

可编程逻辑类型

现场可编程门阵列

CLB-Max的组合延时

2.3 ns

逻辑块数量

1377

等效门数

10000

宽度

50.038 mm

长度

50.038 mm