Microchip A14100A-PG257B

表面安装

NO

终端数量

257

Clock Frequency-Max

100 MHz

Ihs Manufacturer

MICROSEMI CORP

Manufacturer

Microsemi Corporation

Manufacturer Part Number

A14100A-PG257B

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Package Code

HPGA

Package Description

HERMETIC SEALED, CERAMIC, PGA-257

Package Shape

SQUARE

Package Style

GRID ARRAY, HEAT SINK/SLUG

Part Life Cycle Code

Obsolete

Risk Rank

5.81

Supply Voltage-Max

5.5 V

Supply Voltage-Min

4.5 V

Supply Voltage-Nom

5 V

Usage Level

Military grade

ECCN 代码

3A001.A.2.C

HTS代码

8542.39.00.01

技术

CMOS

端子位置

PERPENDICULAR

终端形式

PIN/PEG

端子间距

2.54 mm

Reach合规守则

compliant

JESD-30代码

S-CPGA-P257

温度等级

MILITARY

组织结构

1377 CLBS, 10000 GATES

座位高度-最大

6.7818 mm

可编程逻辑类型

现场可编程门阵列

筛选水平

MIL-STD-883

CLB-Max的组合延时

3 ns

逻辑块数量

1377

等效门数

10000

长度

50.038 mm

宽度

50.038 mm