Microchip A3P1000-2FG256I

表面安装

YES

包装/外壳

FBGA-256

安装类型

表面贴装

供应商器件包装

256-FPBGA (17x17)

终端数量

256

Manufacturer Part Number

A3P1000-2FG256I

Rohs Code

无

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Package Description

BGA,

Risk Rank

5.23

Clock Frequency-Max

350 MHz

Moisture Sensitivity Levels

3

Operating Temperature-Max

100 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Shape

SQUARE

Package Style

网格排列

Supply Voltage-Max

1.575 V

Supply Voltage-Nom

1.5 V

Reflow Temperature-Max (s)

30

Typical Operating Supply Voltage

1.5000 V

Minimum Operating Supply Voltage

1.425 V

Maximum Operating Supply Voltage

1.575 V

Moisture Sensitive

有

Shipping Restrictions

This product may require additional documentation to export from the United States.

Number of Logic Elements

11000 LE

Number of I/Os

177 I/O

Maximum Operating Temperature

+ 100 C

Unit Weight

0.014110 oz

Minimum Operating Temperature

- 40 C

Factory Pack QuantityFactory Pack Quantity

90

Mounting Styles

SMD/SMT

Brand

Microchip Technology / Atmel

Maximum Operating Frequency

350 MHz

Tradename

ProASIC3

RoHS

N

Package

Tray

Base Product Number

A3P1000

厂商

微芯片技术

Product Status

活跃

Supply Voltage-Min

1.425 V

操作温度

-40 to 85 °C

系列

A3P1000

包装

Tray

JESD-609代码

e0

ECCN 代码

3A001.A.7.A

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.39.00.01

子类别

可编程逻辑集成电路

电压 - 供电

1.425V ~ 1.575V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

225

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B256

资历状况

不合格

工作电源电压

1.5 V

温度等级

INDUSTRIAL

数据率

-

组织结构

24576 CLBS, 1000000 GATES

座位高度-最大

1.8 mm

可编程逻辑类型

现场可编程门阵列

产品类别

FPGA - Field Programmable Gate Array

总 RAM 位数

147456

阀门数量

1000000

速度等级

2

收发器数量

-

逻辑块数量

24576

等效门数

1000000

产品类别

FPGA - Field Programmable Gate Array

长度

17 mm

宽度

17 mm