Microchip A3P125-QNG132I

表面安装

YES

终端数量

132

Package Description

VBCC,

Package Style

CHIP CARRIER, VERY THIN PROFILE

Moisture Sensitivity Levels

2

Package Body Material

UNSPECIFIED

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1.5 V

Reflow Temperature-Max (s)

30

Supply Voltage-Min

1.425 V

Operating Temperature-Max

100 °C

Rohs Code

有

Manufacturer Part Number

A3P125-QNG132I

Clock Frequency-Max

350 MHz

Package Code

VBCC

Package Shape

SQUARE

Manufacturer

Microsemi Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICROSEMI CORP

Supply Voltage-Max

1.575 V

Risk Rank

5.24

HTS代码

8542.39.00.01

技术

CMOS

端子位置

BOTTOM

终端形式

BUTT

峰值回流焊温度（摄氏度）

260

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

S-XBCC-B132

资历状况

不合格

温度等级

INDUSTRIAL

组织结构

3072 CLBS, 125000 GATES

座位高度-最大

0.8 mm

可编程逻辑类型

现场可编程门阵列

逻辑块数量

3072

等效门数

125000

宽度

8 mm

长度

8 mm