Microchip A54SX32-1TQG176

表面安装

YES

终端数量

176

Package Shape

SQUARE

Package Style

FLATPACK, LOW PROFILE, FINE PITCH

Supply Voltage-Max

3.6 V

Supply Voltage-Min

3 V

Supply Voltage-Nom

3.3 V

Reflow Temperature-Max (s)

40

Ihs Manufacturer

MICROSEMI CORP

Package Description

LFQFP,

Risk Rank

5.59

Clock Frequency-Max

280 MHz

Moisture Sensitivity Levels

3

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFQFP

Manufacturer Part Number

A54SX32-1TQG176

Rohs Code

有

Part Life Cycle Code

Obsolete

JESD-609代码

e3

端子表面处理

哑光锡

附加功能

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

HTS代码

8542.39.00.01

端子位置

QUAD

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

S-PQFP-G176

资历状况

不合格

温度等级

COMMERCIAL

组织结构

2880 CLBS, 32000 GATES

座位高度-最大

1.6 mm

可编程逻辑类型

现场可编程门阵列

CLB-Max的组合延时

0.8 ns

逻辑块数量

2880

等效门数

32000

宽度

24 mm

长度

24 mm