Microchip ATMXT1664S-CUR

表面安装

YES

终端数量

128

Package

Tape & Reel (TR)

厂商

微芯片技术

Product Status

活跃

RoHS

Non-Compliant

Package Description

VFBGA-128

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA128,13X13,20

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

ATMXT1664S-CUR

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

VFBGA

Package Shape

SQUARE

Manufacturer

Microchip Technology Inc

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Risk Rank

5

系列

maXTouch™

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B128

电源电压-最大值(Vsup)

3.6 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2.5 V

通道数量

1

模拟 IC - 其他类型

模拟电路

座位高度-最大

1 mm

宽度

7 mm

长度

7 mm