Microchip ATMXT224-CUR025

表面安装

YES

终端数量

49

Manufacturer

Siemens Building Technologies

Manufacturer Part Number

599-04303-5.5

Package Description

VFBGA,

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-20 °C

Operating Temperature-Max

85 °C

Supply Voltage-Nom (Vsup)

2.7 V

Package Code

VFBGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Risk Rank

5

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.65 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B49

电源电压-最大值(Vsup)

2.835 V

温度等级

OTHER

电源电压-最小值(Vsup)

2.565 V

模拟 IC - 其他类型

模拟电路

座位高度-最大

1 mm

连接类型

Threaded

宽度

5 mm

长度

5 mm