Microchip ATMXT224S-CCUR043

表面安装

YES

终端数量

64

Package Description

UFBGA-64

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

30

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

ATMXT224S-CCUR043

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

VFBGA

Package Shape

SQUARE

Manufacturer

Microchip Technology Inc

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Risk Rank

5

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

功能数量

1

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B64

电源电压-最大值(Vsup)

3.465 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

3.135 V

模拟 IC - 其他类型

模拟电路

座位高度-最大

0.6 mm

宽度

5 mm

长度

5 mm