Microchip EDI8L32128C25AI

表面安装

YES

终端数量

68

RoHS

Non-Compliant

Package Description

PLASTIC, MO-47AE, LCC-68

Package Style

CHIP CARRIER

Number of Words Code

128000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Access Time-Max

25 ns

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

EDI8L32128C25AI

Number of Words

131072 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

QCCJ

Package Shape

SQUARE

Manufacturer

Microsemi Corporation

Part Life Cycle Code

Transferred

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.82

附加功能

ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX

技术

CMOS

端子位置

QUAD

终端形式

J BEND

功能数量

1

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

S-PQCC-J68

电源电压-最大值(Vsup)

5.25 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

4.75 V

操作模式

ASYNCHRONOUS

组织结构

128KX32

座位高度-最大

4.572 mm

内存宽度

32

记忆密度

4194304 bit

并行/串行

PARALLEL

内存IC类型

SRAM MODULE

备用内存宽度

16

宽度

24.2824 mm

长度

24.2824 mm