Microchip IS2013S-002

表面安装

YES

终端数量

56

Package Description

HVQCCN,

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Package Body Material

UNSPECIFIED

Operating Temperature-Min

-20 °C

Supply Voltage-Nom

1.2 V

Operating Temperature-Max

70 °C

Manufacturer Part Number

IS2013S-002

Package Code

HVQCCN

Package Shape

SQUARE

Manufacturer

Microchip Technology Inc

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Risk Rank

5.63

HTS代码

8542.39.00.01

技术

CMOS

端子位置

QUAD

终端形式

无铅

功能数量

1

端子间距

0.4 mm

Reach合规守则

compliant

JESD-30代码

S-XQCC-N56

温度等级

OTHER

座位高度-最大

0.9 mm

通信IC类型

电信电路

宽度

7 mm

长度

7 mm