Microchip IS2064B-114SM

表面安装

YES

终端数量

61

Manufacturer Part Number

IS2064B-114SM

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Package Description

VFBGA,

Risk Rank

5.61

Operating Temperature-Max

70 °C

Operating Temperature-Min

-20 °C

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Supply Voltage-Nom

1.2 V

Usage Level

Automotive grade

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B61

温度等级

OTHER

座位高度-最大

0.9 mm

筛选水平

TS 16949

通信IC类型

电信电路

长度

5 mm

宽度

5 mm