Microchip IS2064B-114SM-TRAY

工厂交货时间

13 Weeks

表面安装

YES

终端数量

61

RoHS

Compliant

Package Description

VFBGA,

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-20 °C

Supply Voltage-Nom

1.2 V

Operating Temperature-Max

70 °C

Manufacturer Part Number

IS2064B-114SM-TRAY

Package Code

VFBGA

Package Shape

RECTANGULAR

Manufacturer

Microchip Technology Inc

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Risk Rank

5.6

Usage Level

Automotive grade

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B61

温度等级

OTHER

座位高度-最大

0.9 mm

筛选水平

TS 16949

通信IC类型

电信电路

宽度

5 mm

长度

5 mm