Microchip IS2064GM-0L3

表面安装

YES

终端数量

68

Package Description

VFLGA, LGA68,17X17,16

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Package Body Material

UNSPECIFIED

Package Equivalence Code

LGA68,17X17,16

Operating Temperature-Min

-20 °C

Supply Voltage-Nom

1.2 V

Operating Temperature-Max

70 °C

Manufacturer Part Number

IS2064GM-0L3

Package Code

VFLGA

Package Shape

SQUARE

Manufacturer

Microchip Technology Inc

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Risk Rank

5.08

Usage Level

Automotive grade

端子位置

BOTTOM

终端形式

BUTT

功能数量

1

端子间距

0.4 mm

Reach合规守则

compliant

JESD-30代码

S-XBGA-B68

温度等级

OTHER

数据率

1000 Mbps

座位高度-最大

1 mm

筛选水平

ISO/TS-16949

通信IC类型

电信电路

宽度

8 mm

长度

8 mm