Microchip M2GL005-VFG256

表面安装

YES

包装/外壳

BGA-256

安装类型

表面贴装

供应商器件包装

256-FPBGA (14x14)

终端数量

256

Manufacturer Part Number

M2GL005-VFG256

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Package Description

LFBGA,

Risk Rank

5.27

Samacsys Description

FPGA IGLOOu00ae2 Family 6060 Cells 1.2V 256-Pin VFBGA Tray

Moisture Sensitivity Levels

3

Operating Temperature-Max

85 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Supply Voltage-Max

1.26 V

Supply Voltage-Min

1.14 V

Supply Voltage-Nom

1.2 V

Reflow Temperature-Max (s)

30

Moisture Sensitive

有

Shipping Restrictions

This product may require additional documentation to export from the United States.

Distributed RAM

703 kbit

Number of Logic Elements

6060 LE

Number of I/Os

161 I/O

Maximum Operating Temperature

+ 85 C

Unit Weight

0.025037 oz

Minimum Operating Temperature

0 C

Factory Pack QuantityFactory Pack Quantity

119

Mounting Styles

SMD/SMT

Number of Logic Array Blocks - LABs

505 LAB

Brand

Microchip Technology / Atmel

Maximum Operating Frequency

340 MHz

Tradename

IGLOO2

RoHS

Details

Package

Tray

Base Product Number

M2GL005

厂商

微芯片技术

Product Status

活跃

系列

M2GL005

包装

Tray

操作温度

0°C ~ 85°C (TJ)

HTS代码

8542.39.00.01

子类别

可编程逻辑集成电路

电压 - 供电

1.14V ~ 2.625V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B256

工作电源电压

1.2 V

温度等级

OTHER

数据率

-

座位高度-最大

1.56 mm

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

6060

产品类别

FPGA - Field Programmable Gate Array

总 RAM 位数

719872

速度等级

STD

收发器数量

-

产品类别

FPGA - Field Programmable Gate Array

长度

14 mm

宽度

14 mm